US finalises $406m chips subsidy for Taiwan’s GlobalWafers
The US Commerce Department (USCD) has finalised a $406m subsidy for Taiwan's GlobalWafers, a silicon wafer manufacturer, under the US Chips and Science Act. This agreement, which builds on a preliminary accord from July 2024, supports GlobalWafers' subsidiaries, GlobalWafers America (GWA) and MEMC, contingent on achieving specific milestones.