Controlling film thickness to precise specifications is essential for ensuring high yield in high-performance devices.

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

IC ecosystem; UPF 4.0; AI readiness; auto, industrial chiplet SW; PCIe 6; 3D thermal analysis; rad-hard simulation.

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

With each iteration, PCIe has not only increased data bandwidth but also introduced innovations aimed at enhancing power efficiency—a critical factor in today’s energy-conscious computing environment.

Key applications for GenAI and the features they enable, as well as an examination of how model growth and differing model ...

A new technical paper titled “The 2D Materials Roadmap” was published by researchers at many institutions including Chinese ...

Xtreme Pooling allows any test processor on a Pin Scale 5000 card to store vector data in other test processors’ ...